Thin Wafers Market by Wafer Size, Process, Technology, Application and Geography

DUBLIN, October 21, 2022 /PRNewswire/ — The “Global Thin Wafer Market by Wafer Size (125mm, 200mm, 300mm), Process (Temporary Bonding and Debonding and Carrierless/Taiko Process), Technology, Application (MEMS, CIS, Memory, RF Devices, LED , Interposer, Logic) and Geography – Forecast to 2027” was added to the report Offer.



The global thin wafer market is expected to continue growing $11.4 billion in 2022 and is expected to be achieved $20.6 billion until 2027; It is expected to grow at a CAGR of 12.5% ​​from 2022 to 2027.

Reduction in the size of electronic devices, increasing adoption of MEMS technology in wearable health monitoring devices, growing markets for smartphones and consumer electronics, and high material savings are expected to drive the growth of the thin wafer market. However, issues related to maintaining efficiency limit the growth of the thin wafer market.

The 200mm wafer market is expected to hold a significant share during the forecast period

200mm wafers are expected to experience significant demand mainly due to their wide acceptance in power devices, ICs, LEDs, MEMS and many other semiconductor and electronics devices. The 200mm wafers are affordable and easily integrated into various devices. As a result, these wafers are being adopted on a large scale by small and large electronics manufacturers. Additionally, these wafers are increasingly being used to manufacture devices that require small die sizes and ship in the thousands worldwide. Manufacturers of LEDs, RF devices and power transistors use 200mm silicon wafers.

in the May 2022Soitec (France) has launched its first 200mm silicon carbide SmartSiCT wafer. With the release, Soitec is able to expand its SiC product portfolio beyond 150mm, take the development of its SmartSiCT wafers to the next level and meet the growing demand of the automotive market.

Wafer Polishing Equipment Market is expected to grow at the highest CAGR during the forecast period

The growth of the wafer polishing equipment market is attributed to the increasing demand for thinner wafers to integrate microelectronics into various consumer electronics devices. The wafer polishing process produces thinner wafers compared to pure backside grinding and evens out any irregular topography and prevents warping that weakens the wafers. Thus, there is an increased demand for wafer polishing equipment.

In addition, the increasing number of semiconductor factories in countries such as China and Taiwandue to growing investments in semiconductor manufacturing, is expected to contribute to the growth of wafer thinning equipment market.

Asia Pacific to hold the largest share of the thin wafer market during the forecast period

Asia Pacific is expected to hold the largest share of the thin wafer market during the forecast period. That Asia Pacific has seen large-scale introduction of intelligent electronic devices. This has prompted consumer electronics manufacturers to launch higher-end devices in this region.

The acceptance of the latest technology trends by the majority of consumer electronics manufacturers has fueled the demand for thinner wafers Asia Pacific. In recent years, the number of semiconductor factories and IC manufacturing companies in countries such as China and TaiwanThis has paved the way for the growth of the thin wafer market due to investment in semiconductor manufacturing Asia Pacific Region.

Main topics covered:

1 Introduction

2 research methodology

3 Summary

4 premium insights
4.1 Attractive Opportunities for Players in Thin Wafer Market
4.2 Wafer Thinning Equipment Market by Technology
4.3 Thin Wafer Market by Application
4.4 Wafer Thinning Equipment Market by Technology and Application
4.5 Geographical Analysis of Thin Wafer Market

5 Market Overview
5.1 Introduction
5.2 Market Dynamics
5.2.1 Drivers Increasing adoption of MEMS technology in wearable health monitoring devices Reducing the size of electronic devices Growing markets for smartphones and consumer electronics High material savings
5.2.2 Restrictions Efficiency maintenance – Main problem with thin wafers
5.2.3 Opportunities Expansion of the IC industry in China Increasing adoption of IoT and AI in the automotive sector Increasing acceptance of wearable devices
5.2.4 Challenges Volatility and vulnerability to damage from pressure or stress
5.3 Analysis of the value chain
5.4 Ecosystem/Market Map
5.5 Technology Analysis
5.5.1 Silicon Carbide (SiC) Technology
5.6 Case Study Analysis
5.6.1 STMicroelectronics selects Cree bare and epitaxial silicon carbide wafers
5.6.2 Infineon Technologies and UMC Announce Manufacturing Agreement
5.6.3 GlobalWafers Co.Ltd. and Globalfoundries Announce Partnership to Expand Semiconductor Wafer Offerings
5.6.4 VTT uses Okmetic E-Soi wafers for its photonics technology
5.6.5 Silterra Malaysia’s new manufacturing technology for MEMS and photonics devices uses Okmetics C-Soi wafers
5.7 Regulatory Landscape
5.8 Price Analysis

6 Thin Wafers Market by Process
6.1 Introduction
6.2 Temporary Binding and Detachment
6.2.1 Market Adhesives UV releasing adhesives Thermally detachable adhesives Solvent-Releasing Adhesives
6.3 Strapless Approach (Taiko Process)

7 Thin Wafers Market by Wafer Size
7.1 Introduction
7.2 125mm
7.2.1 Introduction of larger diameter wafers by semiconductor manufacturers in the impact segment
7.3 200mm
7.3.1 Steady growth in demand for 200mm wafers during the forecast period
7.4 300mm
7.4.1 The 300mm wafer segment is expected to register the fastest growth during the forecast period

8 Thin Wafer Market by Application
8.1 Introduction
8.2 MEMS
8.2.1 Growth due to high adoption of portable electronic devices
8.3 CIS
8.3.1 Increasing demand for CIS from the automotive industry is expected to boost demand
8.4 Storage
8.4.1 Increasing use of NAND flash memory in mobile electronics to increase demand
8.5 RF Devices
8.5.1 Increasing Adoption of RF Devices in Smartphones to Fuel Market Growth
8.6 LEDs
8.6.1 Increasing demand for LED components in homes and infrastructure to drive the segment
8.7 Interposers
8.7.1 Need for advanced architecture in miniature electronic devices to increase demand
8.8 Logic
8.8.1 High penetration of affordable cloud computing solutions to increase demand
8.9 Miscellaneous

9 Thin Wafer Market by Technology
9.1 Introduction
9.2 Grinding of wafers
9.2.1 Attractive for use in miniaturization of semiconductor devices
9.3 Wafer Polishing
9.3.1 Demand for thin wafers with smooth surface for seamless integration into the powertrain segment
9.4 Wafer Dicing
9.4.1 Wafer Dicing Equipment will account for the largest market share during the forecast period

10 Thin Wafer Market, by Geography

11 competitive landscape
11.1 Competitive Landscape
11.2 Revenue Analysis of Top 5 Companies
11.3 Market Share Analysis (2021)
11.4 Company Valuation Matrix
11.4.1 Stars
11.4.2 Emerging Leaders
11.4.3 Omnipresent Players
11.4.4 Participants
11.5 Start-up/SME evaluation matrix
11.5.1 Progressive Companies
11.5.2 Responsive Companies
11.5.3 Dynamic Enterprises
11.5.4 Starting Blocks
11.6 Thin Wafer Market: Company Profile
11.7 Competitive Situations and Trends
11.7.1 Product Launches
11.7.2 Shops
11.7.3 Miscellaneous

12 company profiles
12.1 Introduction
12.2 Key Players
12.2.1 SK Siltron
12.2.2 Shin-Etsu Chemical Co.Ltd.
12.2.3 Siltronic
12.2.4 Sumco Corporation
12.2.5 GlobalWafers Co.Ltd.
12.2.6 Soitec
12.2.7 SUSS Microtec
12.2.8 Disco Corporation
12.2.9 Okmetics
12.2.10 3M
12.2.11 Applied Materials
12.3 Other companies
12.3.1 Mechatronic system technology
12.3.2 Synova
12.3.3 EV group
12.3.4 Brewery Science
12.3.5 Wafer Works Corporation
12.3.6 Atecom Technology Co. Ltd.
12.3.7 Sil’Tronix Silicon Technologies
12.3.8 LDK Solar
12.3.9 PV Crystalox Solar PLC
12.3.10 University Wafer, Inc.
12.3.11 Shanghai Simgui Technology Co.Ltd
12.3.12 Virginia Semiconductor Inc.
12.3.13 Microelectronics from Silicon Valley
12.3.14 Wafer World Inc.

13 Appendix

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